SOIC 16 1.27mm & TSSOP 16 0.65mm Breakout Board

Product Overview

SOIC 16 1.27mm & TSSOP 16 0.65mm Breakout Board

This breakout board is a type of adapter used in electronics prototyping. It allows you to convert surface-mount devices (SMD) with different pin pitches to a dual in-line package (DIP) format, making it easier to use with breadboards and perf boards.They are useful for prototyping and testing circuits that use SMD components, which are otherwise difficult to work with on standard breadboards.

Features of SOIC 16 1.27mm & TSSOP 16 0.65mm Breakout Board

• SOIC-16 (1.27mm pitch): This side of the breakout board is designed for Small Outline Integrated Circuit (SOIC) packages with a 1.27mm pin pitch.
• TSSOP-16 (0.65mm pitch): The other side is for Thin Shrink Small Outline Package (TSSOP) components with a 0.65mm pin pitch.

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